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Improve Your Yields Through
Innovation
International Test Solutions
provides non-destructive probe card cleaning products used by semiconductor
manufacturers to remove debris
and contaminants generated during wafer level and burn-in/test socket testing. By removing loose debris and adherent contaminants in-line, the
quality of the testing data is improved, the test equipment downtime is
reduced, throughput is increased and manufacturing yields are improved.
Non-destructive probe card cleaning and probe needle cleaning products for wafer level test applications ...
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PROBE CLEAN™
Removes Loose Debris From Probe Tips
Probe Clean™
is a unique highly cross-linked polymeric probe needle cleaning material
that is non-conductive, non-corrosive material that removes
and traps the loose debris that accumulates on the probe
tips and shaft.
Learn more .... |
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PROBE POLISH™
Non-destructively Maintains High Wafer Yield
Probe Polish™
combines the attractive forces of
Probe Clean™
with uniformly and spatially distributed abrasive particles
for the added benefit of removing embedded contaminants
during probe needle cleaning.
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PROBE SCRUB™
Restores Performance and Removes Bonded Debris
Probe Scrub™
is a multilayer probe card cleaning medium developed for collecting
particulates and debris that accumulate on probes during
wafer sort and effectively removing "weld nuggets"
from the probe tip contact surface.
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Precision abrasive products
for probe card cleaning and probe tip "reforming" and
shaping ...
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PROBE
LAP™
Precision Lapping Film for Probe Needle Cleaning
Probe Lap™
is a precision lapping film developed for on-line
probe needle cleaning to impart a proper contact surface finish with
significantly reduced debris generation and provide
consistent contaminant removal across a wide temperature
range (ambient up to 125oC).
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PROBE FORM™
Reshapes Probes for Stable Contact Resistance
Probe Form™
was
developed for cantilevered probe technologies to provide
a cost effective method of uniformly “reforming” a flat
probe tip into a smooth, radius shape.
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Non-destructive cleaning products for burn-in/test socket
applications ...
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TEST CELL CONDITIONER (TCC)
Collects Loose Debris and Removes Adherent Contaminants From
Test Sockets and Contactors
Test Cell
Conditioner (TCC)
is a unique multilayered “surrogate” package form-factor
designed to fit any IC burn-in/test socket and remove all
loose debris and embedded oxides from the contacts and test
socket.
Learn more .... |
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