International Test Solutions’ lines of cleaning products are based on proprietary polymers.  These polymers, combined with abrasives in a variety of configurations and sizes, are designed to meet the cleaning needs of the semiconductor test industry.

Wafer Level Test Products

  PROBE CLEAN™ - Non Abrasive Loose Debris Removal
   Technical Brief - Increased Wafer Yield
   Product Bulletin - Probe Clean on Abrasive Plate
   Product Bulletin - Probe Clean on Silicon Wafer
   Data Sheet - Insertion & Withdrawal Force Curves

  PROBE POLISH™ - Loose and Bonded Debris Removal
   Technical Brief - Non-destructive On-line Probe Card Cleaning
   Product Bulletin - Probe Polish on Abrasive Plate
   Product Bulletin - Probe Polish on Silicon Wafer
   Data Sheet - Probe Polish 70 Insertion & Withdrawal Force Curves
   Data Sheet - Probe Polish 99 Insertion & Withdrawal Force Curves

  PROBE SCRUB™ - Debris Collection on Abrasive Substrate
   Technical Brief - Restore Probe Performance
   Product Bulletin - Probe Scrub on Abrasive Plate (low temperature to 125^oC applications)
   Product Bulletin - Probe Scrub on Silicon Wafer (low temperature to 125^oC applications)

PROBE LAP™ - Abrasive Probe Tip Cleaning
   Technical Brief - Reduced Debris Generation during Abrasive Cleaning
   Product Bulletin - Probe Lap on Abrasive Plate

PROBE FORM™ - Reshape Probe Tips
   Technical Brief - Improve Contact Resistance Stability
   Product Bulletin - Probe Form on Abrasive Plate
   Product Bulletin - Probe Form on Silicon Wafer
   Data Sheet - Insertion & Withdrawal Force Curves

Cleaning Materials for Cascade Microtech Probers
  Probe Clean (CMicro P/N 134-208)
  Probe Polish (CMicro P/N 134-209)
  Probe Scrub (CMicro P/N 134-210)

  COST MODEL - Understand the Total Cost of Cleaning during Wafer Sort
   Click here to download the Cost Model.
   If you have Excel installed it should start automatically. 
   If not, right click here and select "save target as..." or "save link as..."

ITS Cleaning Workshop - Probe Card Cleaning Economics and Methodologies for High Volume Wafer Sort
   Please contact International Test Solutions directly for additional details


Burn-In/Test Socket and Back-End Test Products

  TEST CELL CONDITIONER (TCC) - Extend Contactor / Test Socket Life and Improve OEE